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Title: Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration

A multichip power module directly connecting the busboard to a printed-circuit board that is attached to the power substrate enabling extremely low loop inductance for extreme environments such as high temperature operation. Wire bond interconnections are taught from the power die directly to the busboard further enabling enable low parasitic interconnections. Integration of on-board high frequency bus capacitors provide extremely low loop inductance. An extreme environment gate driver board allows close physical proximity of gate driver and power stage to reduce overall volume and reduce impedance in the control circuit. Parallel spring-loaded pin gate driver PCB connections allows a reliable and reworkable power module to gate driver interconnections.
Authors:
; ; ; ; ;
Publication Date:
OSTI Identifier:
1279755
Report Number(s):
9,407,251
14/100,288
DOE Contract Number:
AR0000111
Resource Type:
Patent
Resource Relation:
Patent File Date: 2013 Dec 09
Research Org:
Cree Fayetteville, Inc. Fayetteville, AR (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING