LTCC Thick Film Process Characterization

Journal Article · Sun May 01 00:00:00 EDT 2016 · Additional Conferences (Device Packaging, HiTec, HiTEN & CiCMT)

DOI:https://doi.org/10.4071/2016cicmt-wp13· OSTI ID:1257811

Girardi, M. A. ^[1]; Peterson, K. A. ^[2]; Vianco, P. T. ^[2]

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1. National Nuclear Security Administration (NNSA), Kansas City, MO (United States). Kansas City National Security Campus
2. Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

Low temperature cofired ceramic (LTCC) technology has proven itself in military/space electronics, wireless communication, microsystems, medical and automotive electronics, and sensors. The use of LTCC for high frequency applications is appealing due to its low losses, design flexibility and packaging and integration capability. Moreover, we summarize the LTCC thick film process including some unconventional process steps such as feature machining in the unfired state and thin film definition of outer layer conductors. The LTCC thick film process was characterized to optimize process yields by focusing on these factors: 1) Print location, 2) Print thickness, 3) Drying of tapes and panels, 4) Shrinkage upon firing, and 5) Via topography. Statistical methods were used to analyze critical process and product characteristics in the determination towards that optimization goal.

• Research Organization: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA)
• Grant/Contract Number: AC04-94AL85000
• OSTI ID: 1257811
• Report Number(s): SAND2016-4120J; 639102
• Journal Information: Additional Conferences (Device Packaging, HiTec, HiTEN & CiCMT), Vol. 2016, Issue CICMT; ISSN 2380-4491
• Publisher: IMAPS
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE