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Title: Cooling apparatus with a resilient heat conducting member

A cooling structure including a thermally conducting central element having a channel formed therein, the channel being configured for flow of cooling fluid there through, a first pressure plate, and a first thermally conductive resilient member disposed between the thermally conducting central element and the first pressure plate, wherein the first pressure plate, the first thermally conductive resilient member, and the thermally conducting central element form a first heat transfer path.
Authors:
; ;
Publication Date:
OSTI Identifier:
1257183
Report Number(s):
9,370,122
13/738,961
DOE Contract Number:
EE0002894
Resource Type:
Patent
Resource Relation:
Patent File Date: 2013 Jan 10
Research Org:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING