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Title: Sintered Cr/Pt and Ni/Au ohmic contacts to B12P2

With this study, icosahedral boron phosphide (B12P2) is a wide-bandgap semiconductor possessing interesting properties such as high hardness, chemical inertness, and the reported ability to self-heal from irradiation by high energy electrons. Here, the authors developed Cr/Pt and Ni/Au ohmic contacts to epitaxially grown B12P2 for materials characterization and electronic device development. Cr/Pt contacts became ohmic after annealing at 700 °C for 30 s with a specific contact resistance of 2×10–4 Ω cm2, as measured by the linear transfer length method. Ni/Au contacts were ohmic prior to any annealing, and their minimum specific contact resistance was ~l–4 × 10–4 Ω cm2 after annealing over the temperature range of 500–800 °C. Rutherford backscattering spectrometry revealed a strong reaction and intermixing between Cr/Pt and B12P2 at 700 °C and a reaction layer between Ni and B12P2 thinner than ~25 nm at 500 °C.
 [1] ;  [1] ;  [2] ;  [1] ;  [1] ;  [1] ;  [1]
  1. Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
  2. Kansas State Univ., Manhattan, KS (United States)
Publication Date:
OSTI Identifier:
Report Number(s):
Journal ID: ISSN 0734-2101; JVTAD6
Grant/Contract Number:
Accepted Manuscript
Journal Name:
Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films
Additional Journal Information:
Journal Volume: 33; Journal Issue: 3; Journal ID: ISSN 0734-2101
American Vacuum Society
Research Org:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org:
Country of Publication:
United States
36 MATERIALS SCIENCE; 42 ENGINEERING; gold; nickel; contact resistance; metal to metal contacts; semiconductor junctions