Origin of high thermal stability of amorphous Ge1Cu2Te3 alloy: A significant Cu-bonding reconfiguration modulated by Te lone-pair electrons for crystallization

Chen, Nian-Ke; Li, Xian-Bin; Wang, Xue-Peng; Xia, Meng-Jiao; Xie, Sheng-Yi; Wang, Hai-Yu; Song, Zhitang; Zhang, Shengbai; Sun, Hong-Bo

doi:10.1016/j.actamat.2015.02.015

Title: Origin of high thermal stability of amorphous Ge1Cu2Te3 alloy: A significant Cu-bonding reconfiguration modulated by Te lone-pair electrons for crystallization

Journal Article · Fri May 01 00:00:00 EDT 2015 · Acta Materialia

DOI:https://doi.org/10.1016/j.actamat.2015.02.015· OSTI ID:1252325

Chen, Nian-Ke; Li, Xian-Bin; Wang, Xue-Peng; Xia, Meng-Jiao; Xie, Sheng-Yi; Wang, Hai-Yu; Song, Zhitang; Zhang, Shengbai; Sun, Hong-Bo

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Sponsoring Organization:: USDOE

Grant/Contract Number:: 2013T60315; 61235004; 11104109; 61307119; 11374119

OSTI ID:: 1252325

Journal Information:: Acta Materialia, Journal Name: Acta Materialia Vol. 90 Journal Issue: C; ISSN 1359-6454

Publisher:: ElsevierCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 36 works

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References (25)

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