A metastable phase of tin in 3D integrated circuit solder microbumps

Liu, Yingxia; Tamura, Nobumichi; Kim, Dong Wook; Gu, Sam; Tu, K. N.

doi:10.1016/j.scriptamat.2015.02.009

Title: A metastable phase of tin in 3D integrated circuit solder microbumps

Journal Article · Mon Jun 01 00:00:00 EDT 2015 · Scripta Materialia

DOI:https://doi.org/10.1016/j.scriptamat.2015.02.009· OSTI ID:1251503

Liu, Yingxia; Tamura, Nobumichi; Kim, Dong Wook; Gu, Sam; Tu, K. N.

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Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES)

Grant/Contract Number:: AC02-05CH11231

OSTI ID:: 1251503

Journal Information:: Scripta Materialia, Journal Name: Scripta Materialia Vol. 102 Journal Issue: C; ISSN 1359-6462

Publisher:: ElsevierCopyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 15 works

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References (8)

Structure refinements and some properties of the transition metal stannides Os3Sn7, Ir5Sn7, Ni0.402(4)Pd0.598Sn4, α-PdSn2 and PtSn4 Künnen, Bernd; Niepmann, Dirk; Jeitschko, Wolfgang Journal of Alloys and Compounds, Vol. 309, Issue 1-2 https://doi.org/10.1016/S0925-8388(00)01042-2	journal	September 2000
New metastable phases in binary tin alloy systems Kane, R. H.; Giessen, B. C.; Grant, N. J. Acta Metallurgica, Vol. 14, Issue 5 https://doi.org/10.1016/0001-6160(66)90068-X	journal	May 1966
The tin-rich intermediate phases in the alloys of tin with cadmium, indium and mercury Raynor, G. V.; Lee, J. A. Acta Metallurgica, Vol. 2, Issue 4 https://doi.org/10.1016/0001-6160(54)90197-2	journal	July 1954
A dedicated superbend x-ray microdiffraction beamline for materials, geo-, and environmental sciences at the advanced light source Kunz, Martin; Tamura, Nobumichi; Chen, Kai Review of Scientific Instruments, Vol. 80, Issue 3 https://doi.org/10.1063/1.3096295	journal	March 2009
Current crowding-induced electromigration in SnAg3.0Cu0.5 microbumps Chiang, Kuo Ning; Lee, Chien Chen; Lee, Chang Chun Applied Physics Letters, Vol. 88, Issue 7 https://doi.org/10.1063/1.2173710	journal	February 2006
Melting and Polymorphism at High Pressures in Some Group IV Elements and III-V Compounds with the Diamond/Zincblende Structure Jayaraman, A.; Klement, W.; Kennedy, G. C. Physical Review, Vol. 130, Issue 2 https://doi.org/10.1103/PhysRev.130.540	journal	April 1963
Effects of Pd concentration on the interfacial reaction and mechanical reliability of the Sn–Pd/Ni system Ho, Cheng-En; Lin, Sheng-Wei; Lin, Yen-Chen Journal of Alloys and Compounds, Vol. 509, Issue 29 https://doi.org/10.1016/j.jallcom.2011.04.142	journal	July 2011
X‐Ray Diffraction Studies on Tin to 100 Kilobars Barnett, J. Dean; Bean, Vern E.; Hall, H. Tracy Journal of Applied Physics, Vol. 37, Issue 2 https://doi.org/10.1063/1.1708275	journal	February 1966

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