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Title: The Role of Interface Reactions on the Performance of Ball-Grid Array Packages Used in High Reliability Electronics.

Abstract not provided.
Authors:
Publication Date:
OSTI Identifier:
1251135
Report Number(s):
SAND2015-3371PE
583541
DOE Contract Number:
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the Lockheed Martin Electronics Packaging Community of Practice Meeting held April 30, 2015 in Syracuse , NY.
Research Org:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org:
USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security (NA-70)
Country of Publication:
United States
Language:
English