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Title: Reliability Analysis of a Pin-in-Hole Solder Joint by Computational Modeling.

Abstract not provided.
Authors:
;
Publication Date:
OSTI Identifier:
1248708
Report Number(s):
SAND2015-2862C
583184
DOE Contract Number:
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the IBSC 2015 held April 19-22, 2015 in Long Beach, CA.
Research Org:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States); Sandia National Laboratories, Kansas City, MO
Sponsoring Org:
USDOE National Nuclear Security Administration (NNSA), Office of Defense Nuclear Security (NA-70)
Country of Publication:
United States
Language:
English