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Title: Silicon-Copper Helical Arrays for New Generation Lithium Ion Batteries

The helical array (with 10 atom % Cu) exhibits 3130 mAh g–1 with 83% columbic efficiency and retains 83% of its initial discharge capacity after 100th cycle. Homogeneously distributed interspaces between the helical arrays accommodate high volumetric changes upon cycling and copper atoms form a conductive network to buffer the mechanical stress generated in the electrode while minimizing electrochemical agglomeration of Si. Also, ion assistance is believed to enhance the density of the helices at the bottom thus increasing the adhesion
Authors:
; ;
Publication Date:
OSTI Identifier:
1244552
DOE Contract Number:
AC02-06CH11357
Resource Type:
Journal Article
Resource Relation:
Journal Name: Nano Letters; Journal Volume: 15; Journal Issue: 10
Publisher:
American Chemical Society
Research Org:
Argonne National Laboratory (ANL)
Sponsoring Org:
Scientific and Technological Research Council of Turkey (TUBITAK)
Country of Publication:
United States
Language:
English
Subject:
CuSi thin film; Lithium-ion batteries; anode; glancing angle deposition; helices; ion-assisted deposition