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Title: Laser Ablation of Thin Films on LTCC.

Abstract not provided.
Authors:
; ; ; ;
Publication Date:
OSTI Identifier:
1241806
Report Number(s):
SAND2014-18690C
540294
DOE Contract Number:
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the IMAPS 2014 ? The Future of Packaging! 47th International Symposium on Microelectronics held October 13-17, 2014 in San Diego, CA.
Research Org:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org:
USDOE Office of Secretary of Energy (S)
Country of Publication:
United States
Language:
English