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Title: Atomic Layer Deposition of Ultrathin TaN and Ternary Ta[subscript 1-X]Al[subscript X]N[subscript y] Films for Cu Diffusion Barrier Applications in Advanced Interconnects

Authors:
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Publication Date:
OSTI Identifier:
1240180
Resource Type:
Journal Article
Resource Relation:
Journal Name: ECS Transactions; Journal Volume: 69; Journal Issue: (7) ; 2015
Research Org:
Argonne National Lab. (ANL), Argonne, IL (United States). Advanced Photon Source (APS)
Sponsoring Org:
DOE - BASIC ENERGY SCIENCES
Country of Publication:
United States
Language:
ENGLISH