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Title: Surface Damage Introduced by Diamond Wire Sawing of Si Wafers: Measuring In-Depth and the Lateral Distributions for Different Cutting Parameters

Authors:
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Publication Date:
OSTI Identifier:
1237080
Report Number(s):
NREL/CP-5J00-64201
DOE Contract Number:
AC36-08GO28308
Resource Type:
Conference
Resource Relation:
Conference: Presented at the Materials Research Society Spring Meeting, 6-10 April 2015, San Francisco, California; Related Information: Emerging Silicon Science and Technology - 2015: Proceedings of the Materials Research Society Spring Meeting, 6-10 April 2015, San Francisco, California
Publisher:
Warrendale, PA: Materials Research Society (MRS)
Research Org:
NREL (National Renewable Energy Laboratory (NREL), Golden, CO (United States))
Sponsoring Org:
USDOE Office of Energy Efficiency and Renewable Energy (EERE), Solar Energy Technologies Office (EE-4S)
Country of Publication:
United States
Language:
English
Subject:
14 SOLAR ENERGY; 36 MATERIALS SCIENCE dislocations; fracture; photovoltaic; silicon; damage; lifetime