Interaction of small mobile stacking fault tetrahedra with free surfaces, dislocations, and interfaces in Cu and Cu-Nb
Journal Article
·
· Physical Review B
- Sponsoring Organization:
- USDOE
- Grant/Contract Number:
- AC52-06NA25396
- OSTI ID:
- 1236975
- Journal Information:
- Physical Review B, Journal Name: Physical Review B Vol. 93 Journal Issue: 5; ISSN 2469-9950
- Publisher:
- American Physical SocietyCopyright Statement
- Country of Publication:
- United States
- Language:
- English
Cited by: 24 works
Citation information provided by
Web of Science
Web of Science
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