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Title: Flip Chip Assembly for Cryogenics and Flexible Substrates

Authors:
; ; ; ; ; ;
Publication Date:
OSTI Identifier:
1236429
Report Number(s):
SLAC-PUB-16429
DOE Contract Number:
AC02-76SF00515
Resource Type:
Conference
Resource Relation:
Conference: Presented at the 2015 IEEE Nuclear Science and Medical Imaging Conference (NSS/MIC 2015), 1 Oct - 07 Nov 2015. San Diego, California, United States
Research Org:
SLAC National Accelerator Laboratory (SLAC)
Sponsoring Org:
US DOE Office of Science (DOE SC)
Country of Publication:
United States
Language:
English
Subject:
OTHER