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Title: Non-permeable substrate carrier for electroplating

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.
Authors:
; ; ; ; ; ; ;
Publication Date:
OSTI Identifier:
1234229
Report Number(s):
9,222,193
13/661,966
DOE Contract Number:
FC36-07GO17043
Resource Type:
Patent
Resource Relation:
Patent File Date: 2012 Oct 26
Research Org:
SunPower Corporation, San Jose, CA (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY; 36 MATERIALS SCIENCE