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Title: Cooling system for electronic components

Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.
Authors:
; ; ; ;
Publication Date:
OSTI Identifier:
1229731
Report Number(s):
9,213,378
13/781,837
DOE Contract Number:
B554331
Resource Type:
Patent
Resource Relation:
Patent File Date: 2013 Mar 01
Research Org:
International Business Machines Corporation, Armonk, NY (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION