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Title: Stability and migration of small copper clusters in amorphous dielectrics

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.4921059· OSTI ID:1228179
 [1]; ORCiD logo [1];  [1]
  1. School of Materials Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana 47907-2044, USA

Sponsoring Organization:
USDOE
OSTI ID:
1228179
Journal Information:
Journal of Applied Physics, Journal Name: Journal of Applied Physics Vol. 117 Journal Issue: 19; ISSN 0021-8979
Publisher:
American Institute of PhysicsCopyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 19 works
Citation information provided by
Web of Science

References (44)

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  • Cheng, Yi-Lung; Chiu, Tai-Jung; Wei, Bor-Jou
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Copper ion diffusion in porous and nonporous SiO2-based dielectrics using bias thermal stress and thermal stress tests journal April 2008
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Bipolar and Unipolar Resistive Switching in Cu-Doped $ \hbox{SiO}_{2}$ journal October 2007
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Atomic origin of ultrafast resistance switching in nanoscale electrometallization cells journal March 2015
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