Low Speed Crack Propagation via Kink Formation and Advance on the Silicon (110) Cleavage Plane
Journal Article
·
· Physical Review Letters
- Sponsoring Organization:
- USDOE
- Grant/Contract Number:
- AC02-06CH11357
- OSTI ID:
- 1227321
- Journal Information:
- Physical Review Letters, Vol. 115, Issue 13; ISSN 0031-9007
- Publisher:
- American Physical SocietyCopyright Statement
- Country of Publication:
- United States
- Language:
- English
Cited by: 20 works
Citation information provided by
Web of Science
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