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Title: III-V/Si wafer bonding using transparent, conductive oxide interlayers

Authors:
; ; ; ; ; ; ;
Publication Date:
OSTI Identifier:
1226769
Grant/Contract Number:
EE00025783
Type:
Publisher's Accepted Manuscript
Journal Name:
Applied Physics Letters
Additional Journal Information:
Journal Volume: 106; Journal Issue: 26; Related Information: CHORUS Timestamp: 2016-12-29 08:15:09; Journal ID: ISSN 0003-6951
Publisher:
American Institute of Physics
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English