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Title: Induction soldering of photovoltaic system components

A method comprises positioning a pair of photovoltaic wafers in a side-by-side arrangement. An interconnect is placed on the pair of wafers such that the interconnect overlaps both wafers of the pair, solder material being provided between the interconnect and the respective wafers. A solder head is then located adjacent the interconnect, and the coil is energized to effect inductive heating of the solder material. The solder head comprises an induction coil shaped to define an eye, and a magnetic field concentrator located at least partially in the eye of the coil. The magnetic field concentrator defines a passage extending axially through the eye of the coil, and may be of a material with a high magnetic permeability.
Authors:
;
Publication Date:
OSTI Identifier:
1226546
Report Number(s):
9,186,741
12/558,095
DOE Contract Number:
FC36-07GO17043
Resource Type:
Patent
Resource Relation:
Patent File Date: 2009 Sep 11
Research Org:
SunPower Corporation, San Jose, CA (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
14 SOLAR ENERGY