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Title: Integrated Double Sided Cooling Packaging of Planar SiC Power Modules-Final paper

Authors:
 [1]
  1. ORNL
Publication Date:
OSTI Identifier:
1222561
DOE Contract Number:
DE-AC05-00OR22725
Resource Type:
Conference
Resource Relation:
Conference: The Seventh Annual IEEE Energy Conversion Congress & Exposition (ECCE 2015), Montreal, Canada, 20150920, 20150920
Research Org:
Oak Ridge National Laboratory (ORNL); Power Electronics and Electric Machinery Research Facility
Sponsoring Org:
EE USDOE - Office of Energy Efficiency and Renewable Energy (EE)
Country of Publication:
United States
Language:
English