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Title: Materials Data on CsDy2Cu3Se5 by Materials Project

Dataset ·
DOI:https://doi.org/10.17188/1193329· OSTI ID:1193329

CsDy2Cu3Se5 crystallizes in the orthorhombic Cmcm space group. The structure is three-dimensional. Cs1+ is bonded in a 8-coordinate geometry to eight Se2- atoms. There are a spread of Cs–Se bond distances ranging from 3.51–3.64 Å. Dy3+ is bonded to six Se2- atoms to form DySe6 octahedra that share a cornercorner with one DySe6 octahedra, corners with four equivalent CuSe4 tetrahedra, edges with four equivalent DySe6 octahedra, and edges with five CuSe4 tetrahedra. The corner-sharing octahedral tilt angles are 27°. There are a spread of Dy–Se bond distances ranging from 2.83–2.94 Å. There are two inequivalent Cu1+ sites. In the first Cu1+ site, Cu1+ is bonded to four Se2- atoms to form CuSe4 tetrahedra that share corners with four equivalent DySe6 octahedra, corners with four CuSe4 tetrahedra, edges with three equivalent DySe6 octahedra, and an edgeedge with one CuSe4 tetrahedra. The corner-sharing octahedra tilt angles range from 17–61°. There are three shorter (2.50 Å) and one longer (2.56 Å) Cu–Se bond lengths. In the second Cu1+ site, Cu1+ is bonded to four Se2- atoms to form CuSe4 tetrahedra that share corners with six CuSe4 tetrahedra and edges with four equivalent DySe6 octahedra. There are two shorter (2.38 Å) and two longer (2.80 Å) Cu–Se bond lengths. There are three inequivalent Se2- sites. In the first Se2- site, Se2- is bonded in a 7-coordinate geometry to two equivalent Cs1+, two equivalent Dy3+, and three Cu1+ atoms. In the second Se2- site, Se2- is bonded to one Cs1+, three equivalent Dy3+, and two equivalent Cu1+ atoms to form a mixture of distorted corner and edge-sharing SeCsDy3Cu2 octahedra. The corner-sharing octahedral tilt angles are 53°. In the third Se2- site, Se2- is bonded in a 6-coordinate geometry to two equivalent Cs1+, two equivalent Dy3+, and two equivalent Cu1+ atoms.

Research Organization:
Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States). LBNL Materials Project
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
Contributing Organization:
MIT; UC Berkeley; Duke; U Louvain
DOE Contract Number:
AC02-05CH11231; EDCBEE
OSTI ID:
1193329
Report Number(s):
mp-18672
Resource Relation:
Related Information: https://materialsproject.org/citing
Country of Publication:
United States
Language:
English

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