Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn–Cu binary and Cu–Sn–Cu sandwich structures
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journal
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August 2013 |
Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests
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journal
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July 2007 |
Eliminate Kirkendall voids in solder reactions on nanotwinned copper
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journal
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March 2013 |
Interfacial reactions of BGA Sn–3.5%Ag–0.5%Cu and Sn–3.5%Ag solders during high-temperature aging with Ni/Au metallization
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journal
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November 2004 |
Synthesis of Single Crystalline Tin Nanorods and Their Application as Nanosoldering Materials
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journal
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December 2010 |
Small particle melting of pure metals
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journal
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November 1986 |
Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
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journal
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May 2012 |
Interfacial reaction of a Sn‐3.0Ag‐0.5Cu thin film during solder reflow
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journal
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February 2013 |
Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8Ag–0.7Cu solder joints
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journal
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November 2012 |
Size-dependent melting properties of tin nanoparticles
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journal
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October 2006 |
Characterization and solderability of cold sprayed Sn–Cu coatings on Al and Cu substrates
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journal
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January 2010 |
Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad
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journal
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September 2003 |
Recent advances of nanolead-free solder material for low processing temperature interconnect applications
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journal
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December 2013 |
Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints
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journal
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August 1998 |
Preferred orientation relationship between Cu6Sn5 scallop-type grains and Cu substrate in reactions between molten Sn-based solders and Cu
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journal
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September 2007 |
Interfacial reactions between lead-free solders and common base materials
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journal
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March 2005 |
Interstitial Diffusion of Copper in Tin
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journal
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July 1967 |
Scallop formation and dissolution of Cu–Sn intermetallic compound during solder reflow
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journal
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March 2002 |
Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening
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journal
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June 1996 |
Intrinsic and Interdiffusion in Cu-Sn System
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journal
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May 2011 |
The Impact of Nanocontact on Nanowire Based Nanoelectronics
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journal
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October 2008 |
Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging
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journal
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February 2005 |
Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
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journal
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February 2011 |
Interdiffusion and reaction in bimetallic Cu-Sn thin films
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journal
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April 1973 |
Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment
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journal
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November 2003 |
On the mechanism of the binary Cu/Sn solder reaction
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journal
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January 2005 |
Microstructure and Interdiffusion of Template-Synthesized Au/Sn/Au Junction Nanowires
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journal
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July 2004 |
Solid state diffusion in Cu–Sn and Ni–Sn diffusion couples with flip-chip scale dimensions
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journal
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March 2007 |
Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging
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journal
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July 2012 |
A review: On the development of low melting temperature Pb-free solders
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journal
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June 2014 |
Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints
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journal
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November 2009 |
The Cu-Sn (Copper-Tin) system
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journal
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June 1990 |
The Cu–Sn phase diagram part II: New thermodynamic assessment
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journal
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March 2013 |
Joining and Interconnect Formation of Nanowires and Carbon Nanotubes for Nanoelectronics and Nanosystems
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journal
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June 2009 |
Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad
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journal
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July 2007 |
Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing
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journal
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May 2007 |
Size-Dependent Melting Properties of Small Tin Particles: Nanocalorimetric Measurements
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journal
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July 1996 |
Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu
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journal
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December 2007 |
Lead-free Sn-Ag and Sn-Ag-Bi solder powders prepared by mechanical alloying
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journal
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April 2003 |
Fast Diffusion and Void Formation in a Two-Segment Copper-Tin Lead-Free Nanowire System with One-Dimensional Confinement
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journal
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August 2012 |
Bottom-up Nanoconstruction by the Welding of Individual Metallic Nanoobjects Using Nanoscale Solder
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journal
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January 2009 |
Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface
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journal
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July 2003 |
Abnormal Cu3Sn Growth and Kirkendall Formation Between Sn and (111) and (220) Preferred-Orientation Cu Substrates
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journal
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January 2011 |
Kinetics of the η–η′ transformation in Cu6Sn5
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journal
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November 2011 |
Synthesis, Characterization, and Thermal Properties of Nanoscale Lead-Free Solders on Multisegmented Metal Nanowires
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journal
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May 2009 |