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Title: In situ visualization of metallurgical reactions in nanoscale Cu/Sn diffusion couples

Journal Article · · Nanoscale
DOI:https://doi.org/10.1039/c4nr06757f· OSTI ID:1193240
 [1];  [2];  [3];  [1];  [3]
  1. State Univ. of New York at Binghamton, Binghamton, NY (United States)
  2. Brookhaven National Lab. (BNL), Upton, NY (United States)
  3. Univ. of Massachusetts, Lowell, MA (United States)

The Cu–Sn metallurgical soldering reaction in two-segmented Cu–Sn nanowires is visualized by in-situ transmission electron microscopy. By varying the relative lengths of Cu and Sn segments, we show that the metallurgical reaction starts at ~ 200 ° with the formation of a Cu–Sn solid solution for the Sn/Cu length ratio smaller than 1:5 while the formation of Cu–Sn intermetallic compounds (IMCs) for larger Sn/Cu length ratios. Upon heating the nanowires up to ~ 500 °C, two phase transformation pathways occur, η-Cu₆Sn₅ → ε-Cu₃Sn → δ-Cu₄₁Sn₁₁ for nanowires with a long Cu segment and η-Cu₆Sn₅ → ε-Cu₃Sn → γ-Cu₃Sn with a short Cu segment. The dynamic in situ TEM visualization of the evolution of Kirkendall voids demonstrates that Cu diffuses faster both in Sn and IMCs than that of Sn in Cu₃ and IMCs, which is the underlying cause of the dependence of the IMC formation and associated phase evolution on the relative lengths of the Cu and Sn segments.

Research Organization:
Brookhaven National Laboratory (BNL), Upton, NY (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
Grant/Contract Number:
SC00112704
OSTI ID:
1193240
Report Number(s):
BNL-108171-2015-JA; NANOHL; KC040302
Journal Information:
Nanoscale, Vol. 7, Issue 11; ISSN 2040-3364
Publisher:
Royal Society of ChemistryCopyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 26 works
Citation information provided by
Web of Science

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Cited By (3)

The Effects of Boron Minerals on the Microstructure and Abrasion Resistance of Babbitt Metal (Sn–Sb–Cu) Used as Coating Materials in Hydroelectric Power Plants journal August 2019
Rapid Formation of Kinetically Sprayed Cu-Sn Intermetallic Film journal October 2019
In situ imaging of the soldering reactions in nanoscale Cu/Sn/Cu and Sn/Cu/Sn diffusion couples journal January 2018

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