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Title: Planar-Bond-All: A Technology for Three-dimensional Integration of Multiple Packaging Functions into Advanced Power Modules

Authors:
 [1]
  1. ORNL
Publication Date:
OSTI Identifier:
1185961
DOE Contract Number:
DE-AC05-00OR22725
Resource Type:
Conference
Resource Relation:
Conference: IEEE International Workshop on Integrated Power Packaging, Chicago, IL, USA, 20150503, 20150503
Research Org:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Power Electronics and Electric Machinery Research Facility
Sponsoring Org:
USDOE Office of Energy Efficiency and Renewable Energy (EERE)
Country of Publication:
United States
Language:
English