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Title: Development of Packaging Technologies for Advanced SiC Power Modules

Authors:
 [1] ;  [1] ;  [1]
  1. ORNL
Publication Date:
OSTI Identifier:
1185663
DOE Contract Number:
AC05-00OR22725
Resource Type:
Conference
Resource Relation:
Conference: The IEEE 2nd WiPDA 2014, Knoxville, TN, USA, 20141013, 20141015
Research Org:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States). Power Electronics and Electric Machinery Research Facility
Sponsoring Org:
EE USDOE - Office of Energy Efficiency and Renewable Energy (EE)
Country of Publication:
United States
Language:
English