skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Bacteriostatic and anti-collagenolytic dental materials through the incorporation of polyacrylic acid modified CuI nanoparticles

Abstract

Provided are antibacterial and antimicrobial surface coatings and dental materials by utilizing the antimicrobial properties of copper chalcogenide and/or copper halide (CuQ, where Q=chalcogens including oxygen, or halogens, or nothing). An antimicrobial barrier is created by incorporation of CuQ nanoparticles of an appropriate size and at a concentration necessary and sufficient to create a unique bioelectrical environment. The unique bioelectrical environment results in biocidal effectiveness through a multi-factorial mechanism comprising a combination of the intrinsic quantum flux of copper (Cu.sup.0, Cu.sup.1+, Cu.sup.2+) ions and the high surface-to-volume electron sink facilitated by the nanoparticle. The result is the constant quantum flux of copper which manifests and establishes the antimicrobial environment preventing or inhibiting the growth of bacteria. The presence of CuQ results in inhibiting or delaying bacterial destruction and endogenous enzymatic breakdown of the zone of resin inter-diffusion, the integrity of which is essential for dental restoration longevity.

Inventors:
; ; ; ;
Publication Date:
Research Org.:
MUSC Foundation for Research Development, Charleston, SC (United States); Clemson Univ., SC (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1179803
Patent Number(s):
9,034,354
Application Number:
13/900,942
Assignee:
MUSC Foundation for Research Development (Charleston, SC); Clemson University (Clemson, SC)
DOE Contract Number:  
FG02-06ER46342
Resource Type:
Patent
Resource Relation:
Patent File Date: 2013 May 23
Country of Publication:
United States
Language:
English
Subject:
59 BASIC BIOLOGICAL SCIENCES; 60 APPLIED LIFE SCIENCES; 36 MATERIALS SCIENCE

Citation Formats

Renne, Walter George, Mennito, Anthony Samuel, Schmidt, Michael Gerard, Vuthiganon, Jompobe, and Chumanov, George. Bacteriostatic and anti-collagenolytic dental materials through the incorporation of polyacrylic acid modified CuI nanoparticles. United States: N. p., 2015. Web.
Renne, Walter George, Mennito, Anthony Samuel, Schmidt, Michael Gerard, Vuthiganon, Jompobe, & Chumanov, George. Bacteriostatic and anti-collagenolytic dental materials through the incorporation of polyacrylic acid modified CuI nanoparticles. United States.
Renne, Walter George, Mennito, Anthony Samuel, Schmidt, Michael Gerard, Vuthiganon, Jompobe, and Chumanov, George. 2015. "Bacteriostatic and anti-collagenolytic dental materials through the incorporation of polyacrylic acid modified CuI nanoparticles". United States. https://www.osti.gov/servlets/purl/1179803.
@article{osti_1179803,
title = {Bacteriostatic and anti-collagenolytic dental materials through the incorporation of polyacrylic acid modified CuI nanoparticles},
author = {Renne, Walter George and Mennito, Anthony Samuel and Schmidt, Michael Gerard and Vuthiganon, Jompobe and Chumanov, George},
abstractNote = {Provided are antibacterial and antimicrobial surface coatings and dental materials by utilizing the antimicrobial properties of copper chalcogenide and/or copper halide (CuQ, where Q=chalcogens including oxygen, or halogens, or nothing). An antimicrobial barrier is created by incorporation of CuQ nanoparticles of an appropriate size and at a concentration necessary and sufficient to create a unique bioelectrical environment. The unique bioelectrical environment results in biocidal effectiveness through a multi-factorial mechanism comprising a combination of the intrinsic quantum flux of copper (Cu.sup.0, Cu.sup.1+, Cu.sup.2+) ions and the high surface-to-volume electron sink facilitated by the nanoparticle. The result is the constant quantum flux of copper which manifests and establishes the antimicrobial environment preventing or inhibiting the growth of bacteria. The presence of CuQ results in inhibiting or delaying bacterial destruction and endogenous enzymatic breakdown of the zone of resin inter-diffusion, the integrity of which is essential for dental restoration longevity.},
doi = {},
url = {https://www.osti.gov/biblio/1179803}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue May 19 00:00:00 EDT 2015},
month = {Tue May 19 00:00:00 EDT 2015}
}

Works referenced in this record:

Antimicrobial denture adhesive and cleanser compositions
patent, September 2000


Dental bonding
patent, October 1995


Characterisation of copper oxide nanoparticles for antimicrobial applications
journal, June 2009


Dental adhesives and restoration compositions
patent, December 1994


Electrospinning: Applications in drug delivery and tissue engineering
journal, May 2008


Antimicrobial adhesive composition for dental uses
patent, March 1998


High-fluence implantation of negative metal ions into polymers for surface modification and nanoparticle formation
journal, June 2005


Bonding composition for dental use
patent, March 2002


A comparison of the mechanical properties of a gallium-based alloy with a spherical high-copper amalgam
journal, March 2001


Dental glass ionomer cement compositions
patent, November 1991


A novel study of antibacterial activity of copper iodide nanoparticle mediated by DNA and membrane damage
journal, August 2012


The Use of Nanoparticles to Control Oral Biofilm Formation
journal, August 2010


The bactericidal effect of silver nanoparticles
journal, August 2005