skip to main content

Title: Composition and method for removing photoresist materials from electronic components

Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the composition in a supercritical state to remove photoresist materials from the substrate.
Authors:
; ;
Publication Date:
OSTI Identifier:
1175216
Report Number(s):
6,846,789
10/133,709
DOE Contract Number:
W-7405-ENG-36
Resource Type:
Patent
Research Org:
University Of California, The Regents Of
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE