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Title: Epitaxial growth of silicon for layer transfer

Patent ·
OSTI ID:1174201

Methods of preparing a thin crystalline silicon film for transfer and devices utilizing a transferred crystalline silicon film are disclosed. The methods include preparing a silicon growth substrate which has an interface defining substance associated with an exterior surface. The methods further include depositing an epitaxial layer of silicon on the silicon growth substrate at the surface and separating the epitaxial layer from the substrate substantially along the plane or other surface defined by the interface defining substance. The epitaxial layer may be utilized as a thin film of crystalline silicon in any type of semiconductor device which requires a crystalline silicon layer. In use, the epitaxial transfer layer may be associated with a secondary substrate.

Research Organization:
National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC36-99GO10337
Assignee:
Alliance for Sustainable Energy, LLC (Golden, CO)
Patent Number(s):
8,987,115
Application Number:
13/059,830
OSTI ID:
1174201
Resource Relation:
Patent File Date: 2010 Feb 25
Country of Publication:
United States
Language:
English

References (7)

Temperature controlled process for the epitaxial growth of a film of material patent May 1994
Process for producing a semiconductor substrate patent December 1997
Rapid low-temperature epitaxial growth using a hot-element assisted chemical vapor deposition process patent June 2001
Process for producing solar cell, process for producing thin-film semiconductor, process for separating thin-film semiconductor, and process for forming semiconductor patent December 2001
Using silicate layers for composite semiconductor patent October 2002
Substrate and production method thereof patent May 2003
Method for rapid, controllable growth and thickness, of epitaxial silicon films patent October 2009

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