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Title: Laser cutting system

Abstract

A workpiece cutting apparatus includes a laser source, a first suction system, and a first finger configured to guide a workpiece as it moves past the laser source. The first finger includes a first end provided adjacent a point where a laser from the laser source cuts the workpiece, and the first end of the first finger includes an aperture in fluid communication with the first suction system.

Inventors:
Publication Date:
Research Org.:
Johnson Controls-SAFT Advanced Power Solutions LLC, Wilmington, DE (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1171654
Patent Number(s):
8,969,756
Application Number:
12/637,578
Assignee:
Johnson Controls--SAFT Advanced Power Solutions LLC (Wilmington, DE)
DOE Contract Number:  
FC26-05NT42403
Resource Type:
Patent
Resource Relation:
Patent File Date: 2009 Dec 14
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Dougherty, Thomas J. Laser cutting system. United States: N. p., 2015. Web.
Dougherty, Thomas J. Laser cutting system. United States.
Dougherty, Thomas J. 2015. "Laser cutting system". United States. https://www.osti.gov/servlets/purl/1171654.
@article{osti_1171654,
title = {Laser cutting system},
author = {Dougherty, Thomas J},
abstractNote = {A workpiece cutting apparatus includes a laser source, a first suction system, and a first finger configured to guide a workpiece as it moves past the laser source. The first finger includes a first end provided adjacent a point where a laser from the laser source cuts the workpiece, and the first end of the first finger includes an aperture in fluid communication with the first suction system.},
doi = {},
url = {https://www.osti.gov/biblio/1171654}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Mar 03 00:00:00 EST 2015},
month = {Tue Mar 03 00:00:00 EST 2015}
}

Works referenced in this record:

Cutting assembly
patent, February 1984


Exhaust system for a laser cutting device
patent, May 1999


Apparatus and method for processing
patent, October 2001