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Title: Power Electronics Thermal Management R&D (Presentation)

This project will investigate and develop thermal-management strategies for wide bandgap (WBG)-based power electronics systems. Research will be carried out to deal with thermal aspects at the module- and system-level. Module-level research will focus on die- and substrate-integrated cooling strategies and heat-transfer enhancement technologies. System-level research will focus on thermal-management strategies for the entire power electronics system to enable smart packaging solutions. One challenge with WBG device-based power electronics is that although losses in the form of heat may be lower, the footprint of the components is also likely to be reduced to reduce cost, weight, and volume. Combined with higher operational temperatures, this creates higher heat fluxes which much be removed from a smaller footprint, requiring advanced cooling strategies.
Authors:
Publication Date:
OSTI Identifier:
1168766
Report Number(s):
NREL/PR-5400-63002
DOE Contract Number:
AC36-08GO28308
Resource Type:
Conference
Resource Relation:
Conference: Presented at the FY15 APEEM Kickoff Meeting, 18-20 November 2014, Oak Ridge National Laboratory, Oak Ridge, Tennessee; Related Information: NREL (National Renewable Energy Laboratory)
Research Org:
National Renewable Energy Laboratory (NREL), Golden, CO.
Sponsoring Org:
USDOE Office of Energy Efficiency and Renewable Energy Vehicle Technologies Office
Country of Publication:
United States
Language:
English
Subject:
25 ENERGY STORAGE; 30 DIRECT ENERGY CONVERSION POWER ELECTRONICS; THERMAL MANAGEMENT; INVERTER COOLING