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Title: Flip Chip Assembly of Thin Substrates, Fine Bump Pitch, and Small Area Prototype Die

Authors:
; ; ; ; ; ; ; ; ; ; ;
Publication Date:
OSTI Identifier:
1165894
Report Number(s):
SLAC-PUB-16168
DOE Contract Number:
AC02-76SF00515
Resource Type:
Conference
Resource Relation:
Conference: Contributed to 2014 IEEE Nuclear Science Cymposium and Medical Imaging Conference 21st Symposium on Room-Temperature Semiconductor X-ray and Gamma-ray Detectors (NSS/MIC 2014 / RTSD 2014), 08-15 Nov 2014. Seattle, WA, USA
Research Org:
SLAC National Accelerator Laboratory (SLAC)
Sponsoring Org:
US DOE Office of Science (DOE SC)
Country of Publication:
United States
Language:
English
Subject:
Instrumentation,ENG