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Title: A Pixel Readout Chip in 40 nm CMOS Process for High Count Rate Imaging Systems with Minimization of Charge Sharing Effects

We present a prototype chip in 40 nm CMOS technology for readout of hybrid pixel detector. The prototype chip has a matrix of 18x24 pixels with a pixel pitch of 100 μm. It can operate both in single photon counting (SPC) mode and in C8P1 mode. In SPC the measured ENC is 84 erms (for the peaking time of 48 ns), while the effective offset spread is below 2 mV rms. In the C8P1 mode the chip reconstructs full charge deposited in the detector, even in the case of charge sharing, and it identifies a pixel with the largest charge deposition. The chip architecture and preliminary measurements are reported.
Authors:
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Publication Date:
OSTI Identifier:
1151753
Report Number(s):
FERMILAB--PUB-13-518-PPD
DOE Contract Number:
AC02-07CH11359
Resource Type:
Conference
Resource Relation:
Journal Name: NSS/MIC 2013 Proceedings; Journal Volume: C13-10-26; Conference: 2013 IEEE Nuclear Science Symposium and Medical Imaging Conference, Seoul, (South Korea), 27 Oct - 02 Nov 2013
Research Org:
Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
Sponsoring Org:
USDOE Office of Science (SC), High Energy Physics (HEP) (SC-25)
Contributing Orgs:
Pixels Collaboration
Country of Publication:
United States
Language:
English
Subject:
Rad Hard Vertex Detector