Thermal Performance and Reliability Characterization of Bonded Interface Materials (BIMs): Preprint
Thermal interface materials are an important enabler for low thermal resistance and reliable electronics packaging for a wide array of applications. There is a trend towards bonded interface materials (BIMs) because of their potential for low thermal resistivity (< 1 mm2K/W). However, BIMs induce thermomechanical stresses in the package and can be prone to failures and integrity risks. Deteriorated interfaces can result in high thermal resistance in the package and degradation and/or failure of the electronics. DARPA's Thermal Management Technologies program has addressed this challenge, supporting the development of mechanically-compliant, low resistivity nano-thermal interface (NTI) materials. In this work, we describe the testing procedure and report the results of NREL's thermal performance and reliability characterization of an initial sample of four different NTI-BIMs.
- Publication Date:
- OSTI Identifier:
- Report Number(s):
- DOE Contract Number:
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- Resource Relation:
- Conference: Presented at ITherm 2014, 27-30 May 2014, Orlando, Florida
- Research Org:
- National Renewable Energy Laboratory (NREL), Golden, CO.
- Sponsoring Org:
- Defense Advanced Research Projects Agency (DARPA)
- Country of Publication:
- United States
- 33 ADVANCED PROPULSION SYSTEMS; 30 DIRECT ENERGY CONVERSION THERMAL INTERFACE; BONDED INTERFACE MATERIAL; ACCELERATED TESTING; THERMAL RESISTANCE; Transportation
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