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Title: Uniqueness and Challenges of Sintered Silver as a Bonded Interface Material

Authors:
 [1] ;  [1] ;  [1] ;  [1]
  1. ORNL
Publication Date:
OSTI Identifier:
1132972
DOE Contract Number:
DE-AC05-00OR22725
Resource Type:
Conference
Resource Relation:
Conference: International Conference on High Temperature Electronics (HiTEC 2014), Albuquerque, NM, USA, 20140513, 20140513
Research Org:
Oak Ridge National Laboratory (ORNL)
Sponsoring Org:
EE USDOE - Office of Energy Efficiency and Renewable Energy (EE)
Country of Publication:
United States
Language:
English