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Title: Structured wafer for device processing

A structured wafer that includes through passages is used for device processing. Each of the through passages extends from or along one surface of the structured wafer and forms a pattern on a top surface area of the structured wafer. The top surface of the structured wafer is bonded to a device layer via a release layer. Devices are processed on the device layer, and are released from the structured wafer using etchant. The through passages within the structured wafer allow the etchant to access the release layer to thereby remove the release layer.
Authors:
;
Publication Date:
OSTI Identifier:
1132054
Report Number(s):
8,729,673
13/239,181
DOE Contract Number:
AC04-94AL85000
Resource Type:
Patent
Research Org:
SNL (Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States))
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING