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Title: Duality of the Interfacial Thermal Conductance in Graphene-based Nanocomposites

The thermal conductance of graphene-matrix interfaces plays a key role in controlling the thermal transport properties of graphene-based nanocomposites. Using classical molecular dynamics simulations, we found that the interfacial thermal conductance depends strongly on the mode of heat transfer at the graphene-matrix interfaces: if heat enters graphene from one side of its basal plane and immediately leaves the graphene through the other side, the corresponding interfacial thermal conductance, G(across), is large; if heat enters graphene from both sides of its basal plane and leaves the graphene at a position far away on its basal plane, the corresponding interfacial thermal conductance, G(non-across), is small. For a single-layer graphene immersed in liquid octane, G(across) is ~150 MW/m2K while Gnon-across is ~5 MW/m2K. G(across) decreases with increasing multi-layer graphene thickness (i.e., number of layers in graphene) and approaches an asymptotic value of 100 MW/m2K for 7-layer graphenes. G(non-across) increases only marginally as the graphene sheet thickness increases. Such a duality of the interface thermal conductance for different probing methods and its dependence on graphene sheet thickness can be traced ultimately to the unique physical and chemical structure of graphene materials. The ramifications of these results in areas such as experimental measurement of thermalmore » conductivity of graphene and the design of graphene-based thermal nanocomposites are discussed.« less
 [1] ;  [2] ;  [3] ;  [2] ;  [1]
  1. Clemson University
  2. ORNL
  3. University of Maryland
Publication Date:
OSTI Identifier:
DOE Contract Number:
Resource Type:
Journal Article
Resource Relation:
Journal Name: Carbon; Journal Volume: 75
Research Org:
Oak Ridge National Laboratory (ORNL); Center for Nanophase Materials Sciences (CNMS); Oak Ridge Leadership Computing Facility (OLCF)
Sponsoring Org:
SC USDOE - Office of Science (SC)
Country of Publication:
United States