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Title: Recent Results for 3D Pixel Integrated Circuits using Copper-Copper and Oxide-Oxide Bonding

Authors:
; ;
Publication Date:
OSTI Identifier:
1128835
Report Number(s):
FERMILAB-PUB-14-020-PPD
DOE Contract Number:
AC02-07CH11359
Resource Type:
Journal Article
Resource Relation:
Journal Name: Proceedings of Science; Conference: Presented at VERTEX 2014 - 23rd International Workshop on Vertex Detectors: VERTEX 2014 - 23rd International Workshop on Vertex Detectors. Doksy, Czech Republic, .
Research Org:
Fermi National Accelerator Laboratory (FNAL), Batavia, IL
Sponsoring Org:
USDOE Office of Science (SC), High Energy Physics (HEP) (SC-25)
Country of Publication:
United States
Language:
English