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Title: Methods and devices for fabricating and assembling printable semiconductor elements

The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
Authors:
; ; ; ; ; ; ;
Publication Date:
OSTI Identifier:
1126915
Report Number(s):
8,664,699
13/801,868
DOE Contract Number:
FG02-91ER45439
Resource Type:
Patent
Research Org:
The Board of Trustees of the University of Illinois, Urbana, IL, USA
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING