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Title: Perforation patterned electrical interconnects

This disclosure describes systems and methods for increasing the usable surface area of electrical contacts within a device, such as a thin film solid state device, through the implementation of electrically conductive interconnects. Embodiments described herein include the use of a plurality of electrically conductive interconnects that penetrate through a top contact layer, through one or more multiple layers, and into a bottom contact layer. The plurality of conductive interconnects may form horizontal and vertical cross-sectional patterns. The use of lasers to form the plurality of electrically conductive interconnects from reflowed layer material further aids in the manufacturing process of a device.
Authors:
Publication Date:
OSTI Identifier:
1117867
Report Number(s):
8,637,996
13/717,364
DOE Contract Number:
AR0000019
Resource Type:
Patent
Research Org:
ITN Energy Systems, Inc, Littleton, CO, USA
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING