Thermal solution enables detailed characterization of filament evolution in resistive switches.
Abstract
Abstract not provided.
- Authors:
- Publication Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE National Nuclear Security Administration (NNSA)
- OSTI Identifier:
- 1114633
- Report Number(s):
- SAND2013-8718J
476961
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Journal Article
- Journal Name:
- Nature Physics
- Additional Journal Information:
- Related Information: Proposed for publication in Nature Physics.
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Mickel, Patrick R., Lohn, Andrew, James, Conrad D., and Marinella, Matthew. Thermal solution enables detailed characterization of filament evolution in resistive switches.. United States: N. p., 2013.
Web.
Mickel, Patrick R., Lohn, Andrew, James, Conrad D., & Marinella, Matthew. Thermal solution enables detailed characterization of filament evolution in resistive switches.. United States.
Mickel, Patrick R., Lohn, Andrew, James, Conrad D., and Marinella, Matthew. 2013.
"Thermal solution enables detailed characterization of filament evolution in resistive switches.". United States.
@article{osti_1114633,
title = {Thermal solution enables detailed characterization of filament evolution in resistive switches.},
author = {Mickel, Patrick R. and Lohn, Andrew and James, Conrad D. and Marinella, Matthew},
abstractNote = {Abstract not provided.},
doi = {},
url = {https://www.osti.gov/biblio/1114633},
journal = {Nature Physics},
number = ,
volume = ,
place = {United States},
year = {Tue Oct 01 00:00:00 EDT 2013},
month = {Tue Oct 01 00:00:00 EDT 2013}
}
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