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Title: Structural Stability of Nanocrystalline Cu Films during Various In-situ TEM Indentation Conditions.

Abstract not provided.
Authors:
; ; ; ; ; ;
Publication Date:
OSTI Identifier:
1114603
Report Number(s):
SAND2013-8943C
477082
DOE Contract Number:
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the MS&T 2013 held October 28 - November 1, 2013 in Montreal, Canada.
Research Org:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org:
USDOE National Nuclear Security Administration (NNSA)
Country of Publication:
United States
Language:
English