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Title: Development of an Analytical Bond Order Potential for Al-Cu-H Systems.

Abstract not provided.
Authors:
; ; ; ;
Publication Date:
OSTI Identifier:
1113047
Report Number(s):
SAND2013-8187C
476396
DOE Contract Number:
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: Proposed for presentation at the 2nd International Conference and Exhibition on Materials Science & Engineering held October 6-10, 2013 in Las Vegas, NV.
Research Org:
Sandia National Laboratories (SNL-CA), Livermore, CA (United States)
Sponsoring Org:
USDOE National Nuclear Security Administration (NNSA)
Country of Publication:
United States
Language:
English