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Title: Unified Creep Plasticity Damage (UCPD) Model for SAC396 Solder.

Abstract not provided.
Authors:
;  [1]
  1. Sandia National Laboratories, Albuquerque, NM
Publication Date:
OSTI Identifier:
1109422
Report Number(s):
SAND2013-7526J
473627
DOE Contract Number:
AC04-94AL85000
Resource Type:
Journal Article
Resource Relation:
Journal Name: Journal of Electronic Packaging; Related Information: Proposed for publication in Journal of Electronic Packaging.
Research Org:
Sandia National Laboratories Albuquerque, NM; Sandia National Laboratories
Sponsoring Org:
USDOE National Nuclear Security Administration (NNSA)
Country of Publication:
United States
Language:
English