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Title: MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads

In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.
Authors:
; ; ; ; ; ; ;
Publication Date:
OSTI Identifier:
1109356
Report Number(s):
8,597,985
13/364,166
DOE Contract Number:
AC04-94AL85000
Resource Type:
Patent
Research Org:
SNL-A (Sandia National Laboratories, Albuquerque, NM (United States))
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
77 NANOSCIENCE AND NANOTECHNOLOGY