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Title: Apparatus and method for deterministic control of surface figure during full aperture polishing

Patent ·
OSTI ID:1108608
; ;

A polishing system configured to polish a lap includes a lap configured to contact a workpiece for polishing the workpiece; and a septum configured to contact the lap. The septum has an aperture formed therein. The radius of the aperture and radius the workpiece are substantially the same. The aperture and the workpiece have centers disposed at substantially the same radial distance from a center of the lap. The aperture is disposed along a first radial direction from the center of the lap, and the workpiece is disposed along a second radial direction from the center of the lap. The first and second radial directions may be opposite directions.

Research Organization:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC52-07NA27344
Assignee:
LLNL
Patent Number(s):
8,588,956
Application Number:
12/695,986
OSTI ID:
1108608
Country of Publication:
United States
Language:
English

References (11)

Pad Conditioner for Chemical Mechanical Polishing patent-application April 2009
Optical monitoring in a two-step chemical mechanical polishing process patent October 2003
Polishing apparatus patent-application November 2001
Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus patent-application January 2006
Extended Life Conditioning Disk patent-application December 2007
Automatic lapping method of a thin film element and a lapping apparatus using the same patent October 2000
Optical monitoring in a two-step chemical mechanical polishing process patent January 2003
Apparatus for and method for polishing workpiece patent June 1998
Method and device for simulation, method and device for polishing, method and device for preparing control parameters or control program, polishing system, recording medium, and method of manufacturing semiconductor device patent-application December 2004
Method for controlling machining process of workpiece patent December 2001
Dual element lapping guide system patent February 2000

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