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Title: Metal deposition using seed layers

Methods of forming a conductive metal layers on substrates are disclosed which employ a seed layer to enhance bonding, especially to smooth, low-roughness or hydrophobic substrates. In one aspect of the invention, the seed layer can be formed by applying nanoparticles onto a surface of the substrate; and the metallization is achieved by electroplating an electrically conducting metal onto the seed layer, whereby the nanoparticles serve as nucleation sites for metal deposition. In another approach, the seed layer can be formed by a self-assembling linker material, such as a sulfur-containing silane material.
Authors:
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Publication Date:
OSTI Identifier:
1108012
Report Number(s):
8,580,100
12/932,372
DOE Contract Number:
FG02-08ER46516
Resource Type:
Patent
Research Org:
Massachusetts Institute of Technology (Cambridge, MA)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE