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Title: Method and apparatus for improved high power impulse magnetron sputtering

A high power impulse magnetron sputtering apparatus and method using a vacuum chamber with a magnetron target and a substrate positioned in the vacuum chamber. A field coil being positioned between the magnetron target and substrate, and a pulsed power supply and/or a coil bias power supply connected to the field coil. The pulsed power supply connected to the field coil, and the pulsed power supply outputting power pulse widths of greater that 100 .mu.s.
Authors:
Publication Date:
OSTI Identifier:
1107879
Report Number(s):
8,574,410
12/989,378
DOE Contract Number:
AC02-05CH11231
Resource Type:
Patent
Research Org:
LBNL (Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States))
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING