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Title: Wafer-level packaging with compression-controlled seal ring bonding

A device may be provided in a sealed package by aligning a seal ring provided on a first surface of a first semiconductor wafer in opposing relationship with a seal ring that is provided on a second surface of a second semiconductor wafer and surrounds a portion of the second wafer that contains the device. Forcible movement of the first and second wafer surfaces toward one another compresses the first and second seal rings against one another. A physical barrier against the movement, other than the first and second seal rings, is provided between the first and second wafer surfaces.
Authors:
Publication Date:
OSTI Identifier:
1107804
Report Number(s):
8,575,748
13/324,076
DOE Contract Number:
AC04-94AL85000
Resource Type:
Patent
Research Org:
SNL-A (Sandia National Laboratories, Albuquerque, NM (United States))
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING