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Title: Defining capabilities of Si and InP photonics.

Conference ·
OSTI ID:1013788

Monolithic photonic integrated circuits (PICs) have a long history reaching back more than 40 years. During that time, and particularly in the past 15 years, the technology has matured and the application space grown to span sophisticated tunable diode lasers, 40 Gb/s electrical-to-optical signal converters with complex data formats, wavelength multiplexors and routers, as well as chemical/biological sensors. Most of this activity has centered in recent years on optical circuits built on either Silicon or InP substrates. This talk will review the three classes of PIC and highlight the unique strengths, and weaknesses, of PICs based on Silicon and InP substrates. Examples will be provided from recent R&D activity.

Research Organization:
Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1013788
Report Number(s):
SAND2010-3143C; TRN: US201110%%742
Resource Relation:
Conference: Proposed for presentation at the Avionics, Fiber-Optics and Photonics Conference 2010 held September 21-23, 2010 in Denver, CO.
Country of Publication:
United States
Language:
English

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