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Title: Technologies 2

Advanced Packaging in Leti. Topics include wafter level packaging, key processes & technologies, applications examples, 3D integration, key processes & technologies, and applications examples.
video
Title: Technologies 2
Authors:
Publication Date: 2011-03-14
OSTI Identifier: 1012145
Other Number(s): Other: CERN FILE ID: 254
Resource Type: Multimedia
Specific Type: Multimedia Presentation
Subject: 36 MATERIALS SCIENCE ; LETI ; CEA ; ATOMS ; PACKAGING ; BONDING ; 3D INTEGRATION
Publisher: CERN
Country of Publication: CERN
Language: English
Run Time: 1:50:48
System Entry Date: 2018-06-20